Silicon <span style='color:red'>Photonics</span> Will Become Key to Semiconductor Future Development
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Silicon Photonics Will Become Key to Semiconductor Future Development

　　In recent years, with the rise of AI and 5G technologies leading to increasing computational demands, Silicon Photonics technology has once again become a focal point of discussion in the semiconductor industry.　　AMEYA360 Perspective:　　Rewriting Semiconductor Development Rules with Silicon Photonics　　Since the development of the semiconductor industry, the industry’s trajectory has largely followed the development predicted by Gordon Moore – roughly doubling the number of transistors that can be accommodated on an integrated circuit approximately every two years. However, as chip sizes continue to shrink, chip architecture design is gradually being challenged. Semiconductor manufacturers, including TSMC, Samsung, and Intel, are striving to break through Moore’s Law as their goal. Others have publicly announced their focus on mature processes (the industry divides at 7nm, with 7nm and below considered advanced processes) and optimization of existing technologies.　　However, even as manufacturers push the boundaries of Moore’s Law, leading to increased transistor density per unit area, signal loss issues inevitably arise during signal transmission since chips rely on electricity to transmit signals. Despite the increased transistor count, power consumption problems persist. Silicon Photonics technology, which replaces electrical signals with optical signals for high-speed data transmission, successfully overcomes this challenge, achieving higher bandwidth and faster data processing. With this approach, chips do not need to cram more transistors per unit area or pursue smaller nanometers and nodes. Instead, they can achieve higher integration and performance on existing processes, further advancing technology.　　Optimistic about Silicon Photonics Technology, but Breakthroughs Will Take Time　　Currently, Silicon Photonics technology still faces various challenges, including alignment and coupling, thermal management, modulation and detection, expansion and integration, among others. Significant breakthroughs are unlikely in the short term, and major global manufacturers are still in the early development stages. In Taiwan, recent reports suggest that TSMC is actively venturing into Silicon Photonics technology. While TSMC has not officially confirmed this news, during the Silicon Photonics International Forum, a senior vice president from TSMC clearly stated, “If a good Silicon Photonics integration system can be provided, it can address the key issues of energy efficiency and AI computing power. This could be a Paradigm Shift, and we might be at the beginning of a new era.”　　This suggests that TSMC is optimistic about the development of Silicon Photonics technology. Although Taiwanese companies have not formally announced their entry into the Silicon Photonics field, it is expected that with the explosive growth in demand for data transmission, storage, and computing driven by AI technology, Silicon Photonics will undoubtedly be a critical technology for future semiconductor development.
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Release time：2023-09-18 16:23 reading：2505 Continue reading>>
TSMC Intensifies Silicon <span style='color:red'>Photonics</span> R&D, Rumored Collaboration with Broadcom and NVIDIA
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TSMC Intensifies Silicon Photonics R&D, Rumored Collaboration with Broadcom and NVIDIA

　　According to a report by Economic Daily, AI is driving a massive demand for data transmission, and silicon photonics and Co-Packaged Optics (CPO) have become new focal points in the industry. TSMC is actively entering this field and is rumored to be collaborating with major customers such as Broadcom and NVIDIA to jointly develop these technologies. The earliest large orders are expected to come in the second half of next year.　　TSMC has already assembled a research and development team of over 200 people, aiming to seize the business opportunities in the emerging market of ultra-high-speed computing chips based on silicon photonics, which are expected to arrive gradually starting next year.　　Regarding these rumors, TSMC has stated that they do not comment on customer and product situations. However, TSMC has a high regard for silicon photonics technology. TSMC Vice President Douglas Yu recently stated publicly, “If we can provide a good silicon photonics integration system, it can address two key issues: energy efficiency and AI computing capability. This could be a paradigm shift. We may be at the beginning of a new era.”　　Silicon photonics was a hot topic at the recent SEMICON Taiwan 2023 with major semiconductor giants like TSMC and ASE giving related keynote speeches. This surge in interest is mainly due to the proliferation of AI applications, which have raised questions about how to make data transmission faster and achieve signal latency reduction. The traditional method of using electricity for signal transmission no longer meets the demands, and silicon photonics, which converts electricity into faster optical transmission, has become the highly anticipated next-generation technology to enhance high-volume data transmission speeds in the industry.　　Industry reports suggest that TSMC is currently collaborating with major customers like Broadcom and NVIDIA to develop new products in the field of silicon photonics and Co-Packaged Optics. The manufacturing process technology ranges from 45 nanometers to 7 nanometers, and with mass production slated for 2025. At that time, it is expected to bring new business opportunities to TSMC.　　Industry sources reveal that TSMC has already organized a research and development team of approximately 200 people. In the future, silicon photonics is expected to be incorporated into CPU, GPU, and other computing processes. By changing from electronic transmission lines to faster optical transmission internally, computing capabilities are expected to increase several tens of times compared to existing processors. Currently, this technology is still in the research and academic paper stage, but the industry has high hopes that it will become a new driver of explosive growth for TSMC’s operations in the coming years.
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Release time：2023-09-11 14:52 reading：2444 Continue reading>>
Keysight, FormFactor, ITRI Collaborate to Deliver Silicon <span style='color:red'>Photonics</span> Test and Measurement Solution
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Keysight, FormFactor, ITRI Collaborate to Deliver Silicon Photonics Test and Measurement Solution

Keysight Technologies announced a collaboration with FormFactor and the Industrial Technology Research Institute (ITRI) to accelerate integrated photonics innovation.Silicon photonics enables the transfer of large amounts of data at high speeds using optical signals instead of electrical signals. The silicon photonics market is gaining momentum for data center, automotive, and other applications as it allows optical devices to be created cost effectively — reducing power and size — using silicon semiconductor fabrication techniques. The global silicon photonics market is expected to grow at a CAGR of 22.3% between 2017 and 2025, according to Inkwood Research.The FormFactor CM300xi, combined with Keysight’s Photonics Application Suite measurement software, provides automated alignment and simultaneous optical-optical and optical-electrical device tests.“Research and academia play an important role in optical communications and serve as industry enablers to the eco-system,” said Dr. Joachim Peerlings, vice president and general manager for networks and data centers at Keysight Technologies. “Keysight is proud to work with ITRI and FormFactor to accelerate integrated photonics innovation and enable customers to scale next generation communications networks to connect and secure the world.”“Silicon photonics is an exciting, emerging application and FormFactor is playing a key role in enabling its maturation and growth,” said Mike Slessor, president and CEO of FormFactor. “Our collaboration with both Keysight and ITRI to successfully develop a turnkey test system is a key milestone in addressing the unique test and measurement challenges of this new class of devices as they move towards high-volume production.”“We are happy to collaborate with Keysight and FormFactor in developing emerging high-speed digital and semiconductor applications such as silicon photonics and optical transceivers,” said Dr. Lin, director of electronic and optoelectronic system research laboratories at ITRI. “Keysight and FormFactor have expertise and testing solutions recognized by several standards organizations and key market players. ITRI is glad to cooperate with these industry leaders to build a silicon photonics testing capability that will service customers.”
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Release time：2018-11-01 00:00 reading：1203 Continue reading>>
Soitec Tunes Wafers for RF, Imagers, <span style='color:red'>Photonics</span>
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Soitec Tunes Wafers for RF, Imagers, Photonics

　　A trending narrative in Europe’s microelectronics industry recently is the comeback of French companies, as illustrated in an increased share of French tech designed into Apple’s iPhone X. Local media are almost giddy with the news, touting big wins by STMicroelectronics and Soitec in Apple’s new flagship iPhone model.　　The good news coincides with both companies’ improved business operations in recent quarters, with rising revenue and net profits.　　On one hand, to the trained eyes watching from Silicon Valley, this France-centric storyline seems a mite provincial. On the other hand, from outside of Silicon Valley’s own bubble, it’s not so difficult to understand why iPhone X represents a new milestone for France. The French see their technology prowess, backed by decades of foundational R&D by top researchers and engineers, breaking the bounds of an Imaging Valley tucked away near the French Alps and gaining worldwide recognition.　　Thus far, both STMicroelectronics and Soitec are mum on their recent design wins. However, the latest iPhone X teardown done by Yole Développement in collaboration with its partner, System Plus Consulting, found ST’s NIR sensor inside iPhone X’s TrueDepth module. It was built using silicon-on-insulator (SOI) wafers developed by Soitec.　　What’s so special about SOI wafers in ST’s NIR sensors? How are they different from other SOI wafers?　　In recent months, Soitec has also been busy talking up not just RF-SOI and FD-SOI, but Photonics-SOI, Imager-SOI and others. What are they, how are they engineered, and what are they for?　　Earlier this month in Paris, EE Times sat down with Paul Boudre, Soitec’s CEO, for an interview.　　Asked about Soitec’s evolving substrate technologies, Boudre first reminded us that Soitec isn’t just a wafer supplier. Its value creation lies in the development of engineered substrates. “Innovation is our core business,” said Boudre. Soitec’s mission is to find “new solutions” demanded by customers, and its customers’ customers. “We engineer new materials, and design to cost” to meet their needs, he explained.　　Although Soitec won’t talk about ST or Apple, the key to Soitec’s big iPhone win is the specific SOI wafers the company developed for ST’s NIR sensors. Pierre Cambou, activity leader for imaging and sensors at Yole, deduced that SOI has played a critical role in improving the sensitivity of NIR sensors — so that ST can meet Apple’s stringent demands for quality and time to market.　　Tuned substrates　　Soitec’s close collaborations with research institutions like CEA-Leti, IMEC and the Université Catholique de Louvain have kept it in the forefront of innovation in SOI-engineered substrates.　　Soitec takes a toolbox approach. “We build a common platform where those research organizations’ tools and Soitec’s own tools and expertise are combined,” Boudre said. This pays off when developing tailor-made products specific to Soitec’s customers and their customers.　　There is more to Soitec’s “Smart Cut” and “Smart Stacking” technologies than meets the eye. They are critical in transferring a thin layer of materials to another substrate to produce a range of high-quality, cost-effective wafers. “We look at the resistivity of a given material, thickness of a layer and its uniformity,” said Boudre. “Our job is to model it, run pilots and validate with our customers.”　　As a result, Soitec has introduced new materials for use in substrates and improved the cost of wafers, while launching a range of new SOI wafers for a variety of applications. They include: RF-SOI, FD-SOI, Power-SOI, Photonics-SOI and Imager-SOI.　　RF-SOI for front-end modules, 5G　　RF-SOI, for example, is widely used for front-end module integration in ultra-low power communication.　　Over the last decade, types of materials and the structure of layers in RF-SOI wafers have evolved, allowing Soitec to develop a tuned substrate that delivers the better RF performance required by a new generation of cellular standards.　　Historically, GaAs was the mainstream substrate for cellular front-end module switches. Soitec originally entered the smartphone market with silicon on sapphire and high resistivity SOI (HR SOI) substrates.　　The early use of sapphire in the substrate for RF-SOI wafers — used by Peregrine Semicondcutor’s RF ICs — eventually transitioned to silicon, explained Boudre, to lower the cost. Thanks to Soitec’s collaboration with the Université Catholique de Louvain, the new RF-SOI wafers maintained low RF insertion loss and reduced crosstalk, similar to quartz substrates, Soitec explained. The two parties joined forces to develop a “trap-rich layer” for RF-SOI wafers, which eventually made it possible to combine silicon CMOS circuits on a RF substrate.　　RF-SOI, now a standard in front-end modules, is “used in 100 percent of smartphones,” according to Soitec. But the company is not standing still.　　Bourdre said, “Further developments of the technology are taking place to address the next RF requirements.” Think advanced LTE, uplink carrier aggregation, massive MIMO, 5G with mmWave, he noted.　　For switches, antennas and tuners of 4G and 5G, sub-6GHz front end, Soitec believes that RF-SOI is critical. Cellular operators are pushing supply chains, including system and fabless chip companies. RF-SOI wafer suppliers like Soitec are working on new materials.  Bourdre also mentioned that Soitec is currently working on new engineered substrate using materials such as piezoelectric — to develop “piezoelectric on insulator.” That will be used for SAW filters, Bourdre said.　　Photonics-SOI for data centers　　Soitec is also counting on the growth of Photonics-SOI wafers, as demand soars for high-speed optical links in data centers and communication infrastructure.　　There are clear advantages in leveraging Photonics-SOI. It allows a path for wavelength multiplexing, bringing the optical transceiver closer to the chip (thus lowering propagation loss). Photonics-SOI also provides higher throughput than direct light modulation and enables “100G and 400G transceivers,” according to the company. Perhaps most important is cost. Photonics-SOI wafers allow standard CMOS fabs to produce optical transmitter and receiver chips.　　Companies such as Intel and Cisco have been actively engaged in Photonics-SOI modeling for their silicon photonics.　　Imager-SOI for NIR sensors　　Clearly, Soitec sees a growing opportunity for its Imager-SOI. Without naming any customers, Soitec listed a number of advantages of Imager-SOI. These include the ability to lower NIR illuminator power consumption, better performance through increased signal to noise ratio, and keeping cost down — because of its “lower die size” compared to bulk for the same resolution　　According to Yole’s Cambou, “Apple’s adoption of ST’s NIR sensors marks the debut of SOI in mass production for image sensors.” He added, “Image sensors are characterized by large surface due to the physical size of light. Therefore, this is a great market to be in for a substrate supplier” like Soitec.　　Evolving business strategy　　Soitec, founded in 1992, has gone through a few management changes, and in business strategies and target markets. Dorian Terral, a financial analyst at Bryan, Garnier & Co. wrote in a research note a year ago that “although Soitec suffered from a complex history, the arrival of a new management team in 2015 and the work carried out since have clearly renewed the group’s profile.”　　Boudre asserts that Soitec’s turnaround “is behind us.” While Soitec “can’t afford to try and test everything” for new engineered substrates, he said that his company today is much better equipped to read the market and tune its technologies for bigger opportunities.　　Boudre explained, “Ten years ago, Soitec was focused on an R&D platform” used in labs. “Today, we are closely working with our customers and our customers’ customers.”　　To drive design wins, Boudre explained, “We brought in a lot of people capable of talk the talk” with customers in such areas as RF, imagers, power and IoT, and understand what customers’ customers need.　　For tomorrow, “Soitec plans to be more focused on the development of innovation platforms.” A case in point is Soitec’s plan to closely work with China Mobile. To be an effective player, Soitec needs to be tuned to the 5G decision-making process.　　Qorvo earlier this year became the first RF supplier to join the China Mobile 5G Innovation Center — an alliance created to develop 5G solutions for China. Soitec is also in the process of joining the alliance.　　The plan is to “create the innovation platform for 5G together with China Mobile, and to qualify the technology by 2019,” Boudre said.　　Acknowledging the fast-changing tech industry landscape, the Soitec CEO said, “We want to know what China Mobile wants, what Alibaba is looking for, and what Google is doing.”
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Release time：2017-11-24 00:00 reading：1324 Continue reading>>

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